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US 11,239,630 B2Granted
Solder sealing in high-power laser devices
AssigneeTeradiode, Inc.
InventorsParviz Tayebati, Michael Deutsch
Life of this patent
Estimating the term…
Abstract
In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
Claims22
A wavelength beam combining laser system comprising:
- a beam emitter configured to emit a plurality of discrete beams and having first and second opposed surfaces;
- focusing optics for focusing the plurality of beams toward a dispersive element;
- the dispersive element for receiving and dispersing the received focused beams;
- a partially reflective output coupler positioned to receive the dispersed beams, transmit a first portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;
- a first electrode mount disposed proximate the first surface of the beam emitter;
- a second electrode mount (i) disposed proximate the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount except for any electrical connection through the beam emitter;
- a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount;
- and
- disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,
- wherein the sealing material and the thermal bonding material comprise different materials.
7 more elements
A wavelength beam combining laser system comprising:
- a beam emitter configured to emit a plurality of discrete beams and having first and second opposed surfaces;
- focusing optics for focusing the plurality of beams toward a dispersive element;
- the dispersive element for receiving and dispersing the received focused beams;
- a partially reflective output coupler positioned to receive the dispersed beams, transmit a first portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;
- a first electrode mount disposed proximate the first surface of the beam emitter;
- a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount;
- and
- disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,
- wherein (i) the sealing material is in direct mechanical contact with an external surface of the beam emitter that does not face toward the first electrode mount, and (ii) the sealing material and the thermal bonding material comprise different materials.
6 more elements
A wavelength beam combining laser system comprising:
- a beam emitter configured to emit a plurality of discrete beams and having first and second opposed surfaces;
- focusing optics for focusing the plurality of beams toward a dispersive element;
- the dispersive element for receiving and dispersing the received focused beams;
- a partially reflective output coupler positioned to receive the dispersed beams, transmit a first portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;
- a first electrode mount disposed proximate the first surface of the beam emitter;
- a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount;
- and
- disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,
- wherein (i) the thermal bonding layer is unexposed and surrounded on all sides by the sealing material, the first electrode mount, and the beam emitter, and (ii) the sealing material and the thermal bonding material comprise different materials.
6 more elements
Dependencies are inferred from the claim text.