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AssigneeThe Regents of the University of California
InventorsBoris Vaisband, Subramanian S. Iyer, Adeel A. Bajwa, Arpan Dasgupta, Arsalan Alam
Estimating the term…
A system is provided for interconnecting multiple functional dies on a single substrate, including: (1) multiple global links in the substrate; (2) multiple local links in the substrate; and (3) multiple utility dies on the substrate, wherein each of the utility dies is connected to at least one of the global links, the utility dies are configured to communicate with one another through the global links, each of the utility dies is connected to at least one of the local links and is configured to communicate with at least one of the functional dies through the at least one of the local links. In some embodiments, an antenna is integrated into the substrate.
A system for interconnecting a plurality of functional dies on a single substrate, comprising:
A system comprising:
A system for interconnecting a plurality of components on a single substrate, comprising:
Dependencies are inferred from the claim text.