Non-flexible substrate having base layer including inorganic film between resin layers, flexible display device and method for producing same

A method of manufacturing a flexible display device, comprising:

• forming a base layer on a non-flexible substrate, the base layer including a first resin layer, an inorganic film, and a second resin layer layered in this order,
• wherein forming of the base layer includes:
• forming the first resin layer inward from an end portion of the non-flexible substrate;
• forming the inorganic film on at least a portion of the first resin layer such that at least the portion of the non-flexible substrate or a portion of the first resin layer is exposed;
• and
• forming the second resin layer in contact with the at least the portion of the non-flexible substrate exposed from the inorganic film or the portion of the first resin layer exposed from the inorganic film, and the method further comprises peeling the non-flexible substrate and bonding a flexible substrate to at least the first resin layer via an adhesive layer,
• wherein the inorganic film is formed such that the first resin layer is exposed at an outer edge portion of the first resin layer, and
• wherein the second resin layer is formed in contact with the first resin layer exposed from the inorganic film.

A method of manufacturing a flexible display device, comprising:

• forming a base layer on a non-flexible substrate, the base layer including a first resin layer, an inorganic film, and a second resin layer layered in this order,
• wherein forming of the base layer includes:
• forming the first resin layer inward from an end portion of the non-flexible substrate;
• forming the inorganic film on at least a portion of the first resin layer such that at least the portion of the non-flexible substrate or a portion of the first resin layer is exposed;
• and
• forming the second resin layer in contact with the at least the portion of the non-flexible substrate exposed from the inorganic film or the portion of the first resin layer exposed from the inorganic film, and the method further comprises peeling the non-flexible substrate and bonding a flexible substrate to at least the first resin layer via an adhesive layer,
• wherein the inorganic film is formed such that the first resin layer is exposed inward from an outer edge portion of the first resin layer, and
• wherein the second resin layer is formed in contact with the first resin layer exposed from the inorganic film.