Method and device for modifying film deposition position

A device for modifying film deposition position in a film deposition process with a mask component, wherein the mask component comprises a mask frame and a mask body fixed to the mask frame, the device comprising:

• a first offset displacement obtainer, configured to obtain a first offset displacement between a plurality of second mark points on the mask component and a plurality of first mark points on the mask body;
• a second offset displacement obtainer, configured to obtain a second offset displacement between a plurality of third mark points on a substrate and the plurality of second mark points on the mask component, wherein the plurality of third mark points are formed on the substrate by the plurality of second mark points when a film is evaporated on the substrate with the mask component;
• an actual offset displacement determiner, configured to determine an actual offset displacement between an actual forming position and a preset forming position of the film, according to the first offset displacement and the second offset displacement;
• and
• a forming position modifier, configured to modify the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film.