Method of producing a composite substrate
AssigneesNGK Insulators, Ltd., NGK Ceramic Device Co., Ltd.
InventorsTomoyoshi Tai, Yuji Hori, Takahiro Yamadera, Ryosuke Hattori, Kengo Suzuki
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Abstract
Described herein is a method of bonding a piezoelectric substrate to a support substrate to form a composite substrate. The piezoelectric substrate has one surface which is positively polarized, and a second surface which is negatively polarized. The method described herein includes the steps of bonding the positively polarized surface of the piezoelectric substrate to one surface of the support substrate by a direct bonding method.
Claims5
A method of producing a composite substrate, comprising a bonding step of bonding a positively-polarized surface of a first substrate, which is a piezoelectric substrate, one surface of which is a negatively-polarized surface and another surface of which is the positively-polarized surface, to one surface of a second substrate, which is a support substrate, by a direct bonding method to produce the composite substrate, wherein the second substrate is not a piezoelectric substrate;
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- a substrate thinning step of grinding and polishing the negatively-polarized surface of the piezoelectric substrate of the composite substrate obtained in the bonding step.
Dependencies are inferred from the claim text.