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US 11,239,403 B2Granted
Light emitting diodes with enhanced thermal sinking and associated methods of operation
AssigneeMicron Technology, Inc.
InventorsKevin Tetz, Charles M. Watkins
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Abstract
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
Claims12
A light emitting diode (LED) device, comprising:
- a heat sink;
- an LED die thermally coupled to the heat sink, the LED die having an emission area;
- an insulating material in direct contact with the LED die, wherein the insulating material is at least partially transparent;
- a phosphor spaced apart from the LED die, the phosphor at least partially corresponding to the emission area of the LED die;
- and
- means for conducting heat away from the phosphor to the heat sink, wherein the means for conducting heat include:
- first means at least partially opposite the phosphor from the LED die and in direct contact with the heat sink, and
- second means at in direct contact with both the insulating material and the heat sink.
5 more elements
Dependencies are inferred from the claim text.