Semiconductor light-emitting device

A semiconductor light-emitting device, comprising:

• a substrate including:
• an insulating base having a base front surface facing in one direction along a thickness direction and a base back surface facing in another direction along the thickness direction;
• a conductive layer formed on the base;
• and an insulating layer covering a part of the conductive layer;
• a semiconductor light-emitting element mounted on the base front surface of the substrate;
• and
• a resin member covering the semiconductor light-emitting element, the resin member being configured to transmit light from the semiconductor light-emitting element, wherein
• the base of the substrate includes:
• a pair of base first side surfaces connecting the base front surface and the base back surface and spaced apart from each other in a first direction;
• and a pair of base third side surfaces connecting the base front surface and the base back surface and each being recessed from one of the base first side surfaces toward the semiconductor light-emitting element as viewed in the thickness direction,
• the conductive layer includes a front-surface segment formed on the base front surface and a side surface segment formed on one of the base third side surfaces,
• the front-surface segment includes a front-surface first part that is integral with the side surface segment and adjacent to the base third side surface at a position closer to the semiconductor light-emitting element,
• the insulating layer includes:
• an insulating-layer first part located opposite from the semiconductor light-emitting element across the base third side surface as viewed in the thickness direction;
• and an insulating-layer second part overlapping the front-surface first part of the conductive layer as viewed in the thickness direction,
• the resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer,
• the insulating-layer first part includes an insulating-layer first surface that is in contact with the resin member, the insulating-layer second part includes an insulating-layer second surface that is in contact with the resin member, wherein a first distance from an insulating-layer first region on the insulating-layer first surface to a resin first region on a resin front surface of the resin member is longer than a second distance from an insulating-layer second region on the insulating-layer second surface to a resin second surface on the resin front surface of the resin member, the resin first region overlapping the insulating-layer first region as viewed in the thickness direction, the resin second region overlapping the insulating-layer second region as viewed in the thickness direction.