Curved pillar interconnects

An electronic device, comprising:

• a target substrate, the target substrate including at least a circuit;
• a curved interconnect on the target substrate, the curved interconnect electrically connected to a contact pad electrically connected to the circuit, and the curved interconnect including at least a portion with curvature;
• and
• a semiconductor device above the target substrate, the semiconductor device including an electrical contact, the electrical contact bonded to the curved interconnect to establish an electrical connection between the electrical contact and the curved interconnect, and the contact pad of the circuit vertically aligned with the electrical contact of the semiconductor device, wherein the semiconductor device is a light-emitting diode (LED) device, and the circuit is configured to drive the LED device.

An electronic device, manufactured by the process of:

• forming a curved interconnect on a target substrate including a circuit, the curved interconnect electrically connected to a contact pad electrically connected to the circuit, and the curved interconnect including at least a portion with curvature;
• positioning the semiconductor device above the target substrate by spatially aligning an electrical contact of the semiconductor device with the curved interconnect of the target substrate such that the contact pad of the circuit is vertically aligned with the electrical contact of the semiconductor device, wherein the semiconductor device is a light-emitting diode (LED) device, and the circuit is configured to drive the LED device;
• and
• bonding the electrical contact of the semiconductor device to the curved interconnect of the target substrate to establish an electrical connection between the electrical contact and the curved interconnect.