Optoelectronic semiconductor component and biometric sensor

An optoelectronic semiconductor component comprising:

• a plurality of optoelectronic semiconductor chips of the same type;
• a reflector having a reflector recess, in which the plurality of optoelectronic semiconductor chips are arranged;
• a lens fully located in the reflector recess where the lens has a plurality of lens recesses in or on which the plurality of optoelectronic semiconductor chips are arranged;
• wherein
• precisely one lens is provided;
• and wherein the lens recesses are assigned uniquely to the plurality of the optoelectronic semiconductor chips;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• and
• the plurality of optoelectronic semiconductor chips does not touch the lens.

An optoelectronic semiconductor component comprising:

• at least one optoelectronic semiconductor chip;
• a reflector having a reflector recess, in which the at least one optoelectronic semiconductor chip is arranged,
• a lens fully located in the reflector recess and which has a lens recess in or on which the at least one optoelectronic semiconductor chip is arranged;
• wherein the lens comprises a lens plateau on a side facing away from the at least one optoelectronic semiconductor chip;
• wherein the lens plateau is a polygon as seen in plan view and is configured to anchor the lens to the reflector;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• and
• the at least one optoelectronic semiconductor chip does not touch the lens.

An optoelectronic semiconductor component, comprising:

• at least one optoelectronic semiconductor chip;
• a reflector having a reflector recess, in which the at least one optoelectronic semiconductor chip is arranged;
• a lens fully located in the reflector recess and which has a lens recess in or on which at least one optoelectronic semiconductor chip is arranged;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• the at least one optoelectronic semiconductor chip does not touch the lens;
• the connecting layer covers the lens outer side to at most 30%, and wherein areas of the lens outer side free of the connecting layer are configured for total internal reflection of radiation generated by the at least one optoelectronic semiconductor chip during operation;
• in areas of the lens outer side covered by the connecting layer, the reflector inner wall is configured for specular reflection of the radiation generated by the at least one optoelectronic semiconductor chip during operation;
• the reflector inner wall is separated from the lens outer side;
• and
• a refractive index difference between the lens and the connecting layer is at most 0.05, expressed in terms of a temperature of 300 K and a maximum-intensity wavelength of the radiation generated by the at least one optoelectronic semiconductor chip during operation.

An optoelectronic semiconductor component, comprising:

• at least one optoelectronic semiconductor chip;
• a reflector having a reflector recess, in which the at least one optoelectronic semiconductor chip is arranged;
• a lens fully located in the reflector recess and which has a lens recess in or on which at least one optoelectronic semiconductor chip is arranged;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• the lens recess comprises a frustoconical lens inner wall and a convexly curved top surface arranged over the at least one optoelectronic semiconductor chip;
• a distance between the top surface and the at least one optoelectronic semiconductor chip is between 0.5 times and two times a diagonal length of the at least one optoelectronic semiconductor chip, inclusive;
• and
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• the at least one optoelectronic semiconductor chip does not touch the lens.

An optoelectronic semiconductor component, comprising:

• at least one optoelectronic semiconductor chip;
• a reflector having a reflector recess, in which the at least one optoelectronic semiconductor chip is arranged;
• a lens fully located in the reflector recess and which has a lens recess in or on which at least one optoelectronic semiconductor chip is arranged;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• the at least one optoelectronic semiconductor chip does not touch the lens;
• the lens is shaped asymmetrically as seen in plan view, and in plan view has a greatest extent along a longitudinal axis and a smallest extent along a transverse axis;
• and
• the longitudinal axis is oriented perpendicularly to the transverse axis.

An optoelectronic semiconductor component, comprising:

• at least one optoelectronic semiconductor chip;
• a reflector having a reflector recess, in which the at least one optoelectronic semiconductor chip is arranged;
• a lens fully located in the reflector recess and which has a lens recess in or on which at least one optoelectronic semiconductor chip is arranged;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• the at least one optoelectronic semiconductor chip does not touch the lens;
• and
• the lens comprises planar lens side surfaces on a side facing away from the at least one optoelectronic semiconductor chip, which are oriented parallel to one another and to the optical axis of the lens, and which extend in a round fashion as seen in side view and widen in the direction away from the at least one optoelectronic semiconductor chip.

An optoelectronic semiconductor component, comprising:

• at least one optoelectronic semiconductor chip;
• a reflector having a reflector recess, in which the at least one optoelectronic semiconductor chip is arranged;
• a lens fully located in the reflector recess and which has a lens recess in or on which at least one optoelectronic semiconductor chip is arranged;
• and
• a connecting layer for fastening the lens on the reflector;
• wherein:
• the lens comprises a lens outer side facing toward a reflector inner wall of the reflector recess;
• a gap between the reflector and the lens is filled only partially with the connecting layer;
• the at least one optoelectronic semiconductor chip does not touch the lens;
• the at least one optoelectronic semiconductor chip comprises at least one first semiconductor chip and one second semiconductor chip, which are configured for different functions and have different emission spectra to one another;
• the at least one first semiconductor chip and the second chip are arranged in a common plane;
• and
• the lens outer side is configured in places for total internal reflection and in places for specular or diffuse reflection of the radiation generated by the first semiconductor chip during operation, and the radiation generated by the second semiconductor chip does not reach the lens outer side.