Light emitting device and method for manufacturing a light emitting device
AssigneeOSRAM OLED GmbH
InventorsLuca Haiberger, Sam Chou
Life of this patent
Estimating the term…
Abstract
A light-emitting device and a method for manufacturing a light-emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner, a foil element on the light-outcoupling surface, an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner and a gas-filled gap located at least in a partial region between the foil element and the optical element.
Claims20
A light-emitting device comprising:
- a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner;
- a foil element on the light-outcoupling surface;
- an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner;
- and
- a gas-filled gap located at least in a partial region between the foil element and the optical element,
- wherein the light-emitting device has laterally delimiting side surfaces comprising side surfaces of the first reflective material, the foil element and the second reflective material.
A method for manufacturing a light-emitting device wherein the light-emitting device comprises a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner, a foil element on the light-outcoupling surface, an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner and a gas-filled gap located at least in a partial region between the foil element and the optical element, the method comprising:
- providing a plurality of light-emitting semiconductor chips on a temporary carrier such that light-outcoupling surfaces of the light-emitting semiconductor chips face away from the temporary carrier;
- laterally enveloping the light-emitting semiconductor chips with the first reflective material so that the first reflective material surrounds each of the light-emitting semiconductor chips laterally in the form-locking manner;
- applying a continuous foil on the light-outcoupling surfaces of the light-emitting semiconductor chips;
- arranging a plurality of optical elements on the continuous foil;
- laterally enveloping the optical elements with the second reflective material so that the second reflective material surrounds each of the optical elements laterally in the form-locking manner;
- and
- separating the first and second reflective materials to form a plurality of singulated light-emitting devices.
A light-emitting device comprising:
- a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner;
- a foil element on the light-outcoupling surface;
- an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner;
- and
- a gas-filled gap located at least in a partial region between the foil element and the optical element,
- wherein the optical element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.
Dependencies are inferred from the claim text.