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US 11,239,377 B2Granted
Optoelectronic module package
AssigneeRockley Photonics Limited
InventorsGerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
Life of this patent
Estimating the term…
Abstract
An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
Claims13
An optoelectronic module, comprising:
- a substrate;
- a digital integrated circuit, on an upper surface of the substrate;
- a frame, secured in a pocket of the substrate, the pocket being in a lower surface of the substrate opposite to the upper surface of the substrate, the frame comprising a first part entirely in the pocket and a second part extending from the first part, the substrate overlapping the entire first part and not overlapping the second part;
- a photonic integrated circuit;
- and
- an analog integrated circuit, connected to the photonic integrated circuit, and to the digital integrated circuit, the analog integrated circuit being connected to the digital integrated circuit through the substrate,
- the frame being composed of a material having a thermal conductivity greater than 10 W/m/K,
- the substrate comprising:
- an insulating layer;
- and
- a plurality of conductive traces, and
- the digital integrated circuit being connected to conductive traces in the substrate through a first array of contacts.
9 more elements
An optoelectronic module, comprising:
- a substrate;
- a digital integrated circuit, on an upper surface of the substrate;
- and
- a frame, secured in a pocket of the substrate, the pocket being in a lower surface of the substrate;
- a carrier secured to an upper surface of the frame;
- a photonic integrated circuit secured to an upper surface of the carrier;
- an analog integrated circuit secured to the upper surface of the carrier;
- and
- a heater in or on the photonic integrated circuit, wherein a total thermal conductivity between the photonic integrated circuit and the frame is less than 10 m W/K,
- the photonic integrated circuit being connected to the analog integrated circuit by first wire bonds,
- the analog integrated circuit being connected to the substrate by second wire bonds, connected to the photonic integrated circuit, and connected to the digital integrated circuit,
- the frame being composed of a material having a thermal conductivity greater than 10 W/m/K,
- the substrate comprising:
- an insulating layer, and
- a plurality of conductive traces,
- the carrier comprising an insulating layer, a plurality of thermal vias forming a thermal path from the analog integrated circuit to the frame, and a plurality of conductive traces,
- the heater being connected to the carrier by third wire bonds, and
- the carrier being connected to the substrate by fourth wire bonds.
15 more elements
An optoelectronic module, comprising:
- a substrate;
- a digital integrated circuit, on an upper surface of the substrate;
- a frame, secured in a recess of the substrate, the recess being in a lower surface of the substrate opposite to the upper surface of the substrate and extending part way through the substrate from the lower surface of the substrate towards the upper surface of the substrate, the substrate overlapping the recess;
- a photonic integrated circuit;
- and
- an analog integrated circuit, connected to the photonic integrated circuit, and to the digital integrated circuit, the analog integrated circuit being connected to the digital integrated circuit through the substrate,
- the frame being composed of a material having a thermal conductivity greater than 10 W/m/K,
- the substrate comprising:
- an insulating layer;
- and
- a plurality of conductive traces, and
- the digital integrated circuit being connected to conductive traces in the substrate through a first array of contacts.
9 more elements
Dependencies are inferred from the claim text.