Semiconductor device and method of manufacturing the same
AssigneeElectronics and Telecommunications Research Institute
InventorsSun Jin Yun, Kwang Hoon Jung, So Hyun Kim, Jung Wook Lim
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Abstract
Provided is a method of manufacturing a semiconductor device. The method includes providing a substrate, forming uneven portions in a region of the substrate in which an electrode is to be formed, forming a precursor film formed of a two-dimensional material on the substrate on which the uneven portions are formed, forming a metal chalcogen film by performing a chalcogenation process on the formed precursor film, and forming the electrode on the formed metal chalcogen film.
Claims12
A method of manufacturing a semiconductor device, the method comprising:
- providing a substrate;
- forming uneven portions in a region of the substrate in which an electrode is to be formed;
- forming a precursor film of a two-dimensional material on the substrate including the uneven portions;
- forming a metal chalcogen film by performing a chalcogenation process on the formed precursor film;
- and
- forming the electrode on a part of the formed metal chalcogen film,
- wherein the forming of the two-dimensional material on the substrate on which the uneven portions are formed includes forming the two-dimensional material film in regions including one or more contact regions and a channel region, and
- wherein the forming of the metal chalcogenide film by performing the chalcogenation process of the formed precursor film includes:
- forming a two-dimensional material layer including crystalline planes oriented in a direction parallel to the substrate in the channel region;
- and
- forming two-dimensional material layers including crystalline planes oriented in a direction perpendicular to the substrate in valley portions of the contact regions.
Dependencies are inferred from the claim text.