Semiconductor memory device capable of suppressing leakage current
AssigneeKioxia Corporation
InventorsShoichi Watanabe, Mitsuhiro Noguchi
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AssigneeKioxia Corporation
InventorsShoichi Watanabe, Mitsuhiro Noguchi
Estimating the term…
According to a certain embodiment, the nonvolatile semiconductor memory device includes: a first conductivity-type semiconductor substrate including a crushed layer on a back side surface thereof; a memory cell array disposed on a front side surface of the semiconductor substrate opposite to the crushed layer; and a first conductivity-type high voltage transistor HVP disposed on the semiconductor substrate and including a first conductivity-type channel, configured to supply a high voltage to the memory cell array. The first conductivity-type high voltage transistor includes: a well region NW disposed on the surface of the semiconductor substrate and having a second conductivity type; a source region and a drain region disposed in the well region; and a first conductivity-type first high concentration layer WT2 disposed between the crushed layer of the semiconductor substrate and the well region and having a higher concentration than an impurity concentration of the semiconductor substrate.
A semiconductor device comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.