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US 11,239,276 B2Granted
CMOS color image sensors with metamaterial color splitting
AssigneeCalifornia Institute of Technology
InventorsGregory Roberts, Philip Camayd-Munoz, Conner Ballew, Andrei Faraon
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Abstract
Methods to build multi-functional scattering structures while respecting tight requirements imposed by manufacturing processes are described. The described methods and devices are based on etching away wire networks embedded in 3D structures to form voids in order to perform a target function. Optimization algorithms for designing binarized devices that meet manufacturing requirements are also disclosed.
Claims13
A method for building a three-dimensional (3D) scattering structure, comprising:
- forming a dielectric structure comprising a first dielectric and a network of metal wires, wherein location, shape and size of the metal wires are selected according to one or more target functions;
- and
- etching away the metal wires from the dielectric structure, thus forming a structure containing spaces filled with the first dielectric and voids, wherein location, shape and size of the voids is according to the one or more target functions,
- wherein the thus formed 3D light scattering structure is configured to receive electromagnetic waves and scatter the electromagnetic waves in accordance with the one or more target functions.
1 more element
Dependencies are inferred from the claim text.