Etch method for opening a source line in flash memory
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYong-Sheng Huang, Ming Chyi Liu, Chih-Pin Huang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYong-Sheng Huang, Ming Chyi Liu, Chih-Pin Huang
Estimating the term…
Various embodiments of the present disclosure are directed towards a method for opening a source line in a memory device. An erase gate line (EGL) and the source line are formed elongated in parallel. The source line underlies the EGL and is separated from the EGL by a dielectric layer. A first etch is performed to form a first opening through the EGL and stops on the dielectric layer. A second etch is performed to thin the dielectric layer at the first opening, wherein the first and second etches are performed with a common mask in place. A silicide process is performed to form a silicide layer on the source line at the first opening, wherein the silicide process comprises a third etch with a second mask in place and extends the first opening through the dielectric layer. A via is formed extending through the EGL to the silicide layer.
A memory device comprising:
An integrated circuit (IC) comprising:
A memory device comprising:
Dependencies are inferred from the claim text.