Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsTomoyuki Obata, Soichi Yoshida, Tetsutaro Imagawa, Seiji Momota
Life of this patent
Estimating the term…
Loading patent…
AssigneeFuji Electric Co., Ltd.
InventorsTomoyuki Obata, Soichi Yoshida, Tetsutaro Imagawa, Seiji Momota
Estimating the term…
Provided is a semiconductor device having transistor and diode sections. The semiconductor device comprises: a gate metal layer provided above the upper surface of a semiconductor substrate; an emitter electrode provided above the upper surface of the semiconductor substrate; a first conductivity-type emitter region provided on the semiconductor substrate upper surface side in the transistor section; a gate trench section, which is provided on the semiconductor substrate upper surface side in the transistor section, is electrically connected to the gate metal layer, and is in contact with the emitter region; an emitter trench section, which is provided on the semiconductor substrate upper surface side in the diode section, and is electrically connected to the emitter electrode; and a dummy trench section, which is provided on the semiconductor substrate upper surface side, is electrically connected to the gate metal layer, and is not in contact with the emitter region.
A semiconductor device having a transistor section, a current sense section and a diode section, the semiconductor device comprising:
A semiconductor device having a transistor section and a current sense section, the semiconductor device comprising:
Dependencies are inferred from the claim text.