Power conversion device including a plurality of semiconductor modules

A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring, the power conversion device comprising:

• a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel,
• a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel,
• a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series,
• a positive electrode bus bar included in the positive electrode wiring, and
• a negative electrode bus bar included in the negative electrode wiring,
• wherein
• a plurality of semiconductor modules including the first semiconductor module, the second semiconductor module, and the third semiconductor module are layered to form a layered portion,
• each of the plurality of semiconductor modules comprises a plurality of power terminals protruding in one of opposite directions along the vertical direction orthogonal to the layering direction of the layered portion,
• a bus bar body portions comprising the positive electrode bus bar and the negative electrode bus bar opposed to each other is disposed on one side in the lateral direction orthogonal to both the layering direction and the vertical direction with respect the layered portion as viewed from the vertical direction,
• an output terminal included in the plurality of power terminals 21 and connected to output wiring is disposed farthest from the bus bar body portions in the lateral direction,
• a positive electrode terminal connected to the positive electrode bus bar and a negative electrode terminal connected to the negative electrode bus bar, the positive electrode terminal and the negative electrode terminal being included in the plurality of power terminals, are disposed closest to the bus bar body portions in the lateral direction, and
• the output terminal in the first semiconductor module and the output terminal in the second semiconductor module are disposed at a same position as a position of the output terminal in the third semiconductor module or positioned closer to the bus bar body portions than the reference terminal, in the lateral direction.

A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring, the power conversion device comprising:

• a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel,
• a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and
• a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series,
• wherein
• the first semiconductor module and the second semiconductor module are layered and each comprise a module body portion and two power terminals protruding from the module body portion in one of opposite directions along the vertical direction orthogonal to the layering direction, and as viewed from the layering direction, the two power terminals are disposed on opposite sides across a center line passing through a center in the lateral direction orthogonal to both the layering direction and the vertical direction.

A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring, the power conversion device comprising:

• a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel,
• a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and
• a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series,
• wherein
• a plurality of semiconductor modules including the first semiconductor module, the second semiconductor module, and the third semiconductor module are layered to form a layered portion,
• each of the plurality of semiconductor modules comprises a plurality of power terminals protruding in one of opposite directions along the vertical direction orthogonal to the layering direction of the layered portion, and
• the plurality of semiconductor modules are disposed such that, of edges of the plurality of power terminals in the lateral direction orthogonal to both the layering direction and the vertical direction, at least two edges facing opposite directions overlap in the layering direction.

A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring, the power conversion device comprising:

• a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel,
• a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel,
• a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series, and
• a circuit board including a driving circuit driving the switching circuit unit,
• wherein
• the first semiconductor module, the second semiconductor module, and the third semiconductor module each comprise the power terminal protruding opposite to the circuit board.