Light emitting diode array containing a black matrix and an optical bonding layer and method of making the same

A light emitting device comprising:

• a backplane;
• an array of light emitting diodes attached to a front side of the backplane;
• a transparent conductive layer contacting front side surfaces of the light emitting diodes;
• an optical bonding layer located over a front side surface of the transparent conductive layer;
• a transparent cover plate located over a front side surface of the optical bonding layer;
• and
• a black matrix layer including an array of openings therethrough, wherein the black matrix layer is located between the optical bonding layer and the transparent cover plate,
• wherein a bottom surface of the optical bonding layer forms a continuous planar interface with an upper surface of the transparent conductive layer that extends continuously over respective front side surfaces of a plurality of light emitting diodes of the array of light emitting diodes, and an upper surface of the optical bonding layer contacts a bottom surface of the black matrix layer in areas outside of the array of openings through the black matrix layer, and the upper surface of the optical bonding layer contacts a bottom surface of the transparent cover plate in areas inside the array of openings through the black matrix layer and the optical bonding layer extends continuously under the bottom surface of the black matrix layer from a first opening to a second opening of the array of openings through the black matrix layer.