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US 11,239,204 B2Granted
Bonded assembly containing laterally bonded bonding pads and methods of forming the same
AssigneeSanDisk Technologies LLC
InventorsChen Wu, Peter Rabkin, Yangyin Chen, Masaaki Higashitani
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Abstract
A bonded assembly includes a first die containing first bonding pads having sidewalls that are laterally bonded to sidewalls of second bonding pads of a second die.
Claims20
A bonded assembly comprising:
- a first semiconductor die comprising first semiconductor devices and first bonding pads having a top surface facing away from the first semiconductor devices, a bottom surface facing the first semiconductor devices and at least one sidewall between the top surface and the bottom surface;
- and
- a second semiconductor die comprising second semiconductor devices and second bonding pads having a top surface facing away from the second semiconductor devices, a bottom surface facing the second semiconductor devices and at least one sidewall between the top surface and the bottom surface;
- wherein the sidewalls of the second bonding pads are bonded to the respective sidewalls of the first bonding pads.
1 more element
A method of forming a bonded assembly, comprising:
- providing a first semiconductor die comprising first semiconductor devices and first bonding pads having a top surface facing away from the first semiconductor devices, a bottom surface facing the first semiconductor devices and at least one exposed sidewall between the top surface and the bottom surface;
- a second semiconductor die comprising second semiconductor devices and second bonding pads having a top surface facing away from the second semiconductor devices, a bottom surface facing the second semiconductor devices and at least one exposed sidewall between the top surface and the bottom surface;
- and
- bonding the exposed sidewalls of the second bonding pads to the respective exposed sidewalls of the first bonding pads.
1 more element
Dependencies are inferred from the claim text.