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AssigneeBoe Technology Group Co., Ltd.
InventorsLili Wang, Haiwei Sun, Zhenxing Tang, Feng Qu, Jing Liu, Chao Liu, Chuhang Wang, Qiangwei Cui, Ke Meng, Linhui Gong
Estimating the term…
A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
A chip bonding method for bonding a chip to a display module, the display module comprising a substrate and a functional layer on the substrate, the substrate comprising a first substrate portion and a second substrate portion, the functional layer being on the first substrate portion, and an electrode being on an upper side of the second substrate portion;
Dependencies are inferred from the claim text.