Semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorSatoshi Shiraki
Life of this patent
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Abstract
A semiconductor device includes a metal chip mounting member and a semiconductor chip bonded to the chip mounting member through a metal sintered material, wherein the metal sintered material includes a first portion overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the semiconductor chip in the plan view, and wherein a porosity ratio of the first portion is greater than or equal to 1% and less than 15%, and a porosity ratio of the second portion is greater than or equal to 15% and less than or equal to 50%.
Claims15
A semiconductor device, comprising:
- a chip mounting member;
- and
- a semiconductor chip bonded to the chip mounting member through a metal sintered material,
- wherein the metal sintered material includes a first portion overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the semiconductor chip in the plan view, and
- wherein a porosity ratio of the first portion is greater than or equal to 1% and less than 15%, and a porosity ratio of the second portion not covered by the semiconductor chip is greater than or equal to 15% and less than or equal to 50%, wherein a thickness of the second portion is thicker than a thickness of the first portion.
A semiconductor device, comprising:
- a chip mounting member;
- and
- a semiconductor chip bonded to the chip mounting member through a metal sintered material,
- wherein the metal sintered material includes a first portion overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the semiconductor chip in the plan view,
- wherein a porosity ratio of the second portion is greater than a porosity ratio of the first portion, and
- wherein the second portion directly covers at least a portion of a lateral surface of the semiconductor chip, wherein a thickness of the second portion is thicker than a thickness of the first portion.
Dependencies are inferred from the claim text.