Back to results
US 11,239,192 B2Granted
Method and system for packing optimization of semiconductor devices
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsGlenn Rinne, Daniel Richter
Life of this patent
Estimating the term…
Abstract
Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.
Claims20
An apparatus, comprising:
- a substrate having a first surface and a second surface opposite the first surface, wherein the second surface comprises isosceles wedge-shaped regions bounded by first radial reference lines that radiate from a radial origin of the second surface and define an acute central angle of each isosceles wedge-shaped region at the radial origin;
- and
- first interconnects arranged in each of the isosceles wedge-shaped regions, wherein each first interconnect includes a minor axis and a major axis greater than its respective minor axis, and wherein the major axis of each first interconnect in its respective isosceles wedge-shaped region is parallel to a second radial reference line that radiates from the radial origin and bisects the respective isosceles wedge-shaped region.
An apparatus, comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- and
- interconnects arranged on the second surface of the substrate;
- wherein the interconnects include a first quantity of interconnects arranged along a first circular reference line and a second quantity of interconnects arranged along a second circular reference line;
- wherein the first and second circular reference lines that are concentric about a radial origin and the first circular reference line is radially outward from the second circular reference line;
- wherein the first quantity of interconnects is greater than the second quantity of interconnects;
- wherein every interconnect along the first and second circular reference lines includes a minor axis and a major axis greater than its respective minor axis;
- and
- wherein the major axis of every interconnect along the first and second circular reference lines is perpendicular to its respective circular reference line.
6 more elements
A method comprising:
- receiving a substrate having a first surface and a second surface opposite the first surface;
- and
- arranging interconnects on the second surface of the substrate such that the interconnects include at least one of:
- first interconnects arranged in each isosceles wedge-shaped region of the second surface bounded by first radial reference lines that radiate from a radial origin of the second surface and form acute central angles at the radial origin, wherein each first interconnect includes a minor axis and a major axis greater than its respective minor axis, and wherein the major axis of each first interconnect in its respective isosceles wedge-shaped region is parallel to a second radial reference line that radiates from the radial origin and bisects the respective isosceles wedge-shaped region;
- or
- second interconnects along circular reference lines that are concentric about the radial origin of the second surface of the substrate, wherein every interconnect along the circular reference lines includes a minor axis and a major axis greater than its respective minor axis;
- and wherein the major axis of every interconnect along the circular reference lines is perpendicular to its respective circular reference line.
4 more elements
Dependencies are inferred from the claim text.