Electronic component and semiconductor device

An electronic component comprising:

• a semiconductor substrate having a first main surface on one side and a second main surface on the other side;
• a main surface insulation layer formed on the first main surface of the semiconductor substrate;
• a wiring layer formed on the main surface insulation layer;
• a chip having a first chip main surface on one side and a second chip main surface on the other side, and a plurality of electrodes formed on an upper portion of the first chip main surface and an electrode formed on the second chip main surface, the chip being arranged on the wiring layer;
• a sealing insulation layer that seals the chip on the first main surface of the semiconductor substrate such that the second main surface of the semiconductor substrate is exposed, the sealing insulation layer having a sealing main surface that opposes the first main surface of the semiconductor substrate;
• a plurality of external terminals formed to penetrate through the sealing insulation layer so as to be exposed from the sealing main surface of the sealing insulation layer, the external terminals being respectively electrically connected to the plurality of electrodes of the chip;
• and
• a chip side external terminal formed on the wiring layer to penetrate through the sealing insulation layer, the chip side external terminal being electrically connected to the one of the electrodes of the chip,
• wherein the semiconductor substrate has a thickness A and the sealing insulation layer has a thickness B, where the thickness A is larger than the thickness B.