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US 11,239,186 B2Granted
Die with embedded communication cavity
AssigneeIntel Corporation
InventorsDigvijay Raorane, Vijay K. Nair
Life of this patent
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Abstract
Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.
Claims12
A device comprising:
- a substrate with first interconnect routing therein, the first interconnect routing at a first density;
- a communication cavity in the substrate;
- an interconnect structure embedded in the substrate over the communication cavity, the interconnect structure including second interconnect routing at a second density, the first density lower than the second density;
- a first and a second antenna exposed in and enclosed by the communication cavity and communicatively coupled to each other wirelessly through transmission of electromagnetic waves in the communication cavity, the second interconnect routing electrically coupled to the first and second antenna;
- and
- a first die and a second die on the interconnect structure, the first and second dies electrically connected to the first interconnect routing and electrically connected to each other through the second interconnect routing, the first die electrically connected to the first antenna and the second die electrically connected to the second antenna.
3 more elements
A device comprising:
- a substrate with a cavity formed therein;
- first and second antennas exposed in and enclosed by the cavity and communicatively coupled to each other wirelessly through transmission of electromagnetic waves in the cavity;
- and
- an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers, the interconnect structure including interconnect routing electrically coupled to the first and the second antennas.
1 more element
Dependencies are inferred from the claim text.