Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
AssigneeInternational Business Machines Corporation
InventorsTuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles Leon Arvin, Steven Paul Ostrander, Thomas Weiss
Life of this patent
Estimating the term…
Abstract
A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.
Claims18
A method comprising:
- providing a stiffener at a bottom side of an organic laminate substrate by indenting the substrate, depositing an adhesive into the indentation in the substrate, and placing the stiffener into the indentation with sufficient pressure to displace the adhesive at contact points between the stiffener and circuitry of the substrate, wherein the stiffener extends across a stiffening region and does not protrude beyond a bottom side metallization of the substrate;
- and
- fabricating a multi-chip module by mounting first and second chips to a top side of the substrate, wherein the first and second chips define a chip gap region between opposing edges thereof, and the chip gap region overlies the stiffening region.
An article of manufacture comprising:
- an organic laminate substrate;
- first and second semiconductor device chips mounted to a top side of the substrate and defining a chip gap region between opposing edges of the chips;
- and
- a stiffener embedded in the bottom side of the substrate, wherein the stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate;
- wherein the stiffener comprises a plurality of stiffener bars that are separated by at least one inter-bar gap, wherein at least one silicon bridge forms an electrical connection between the chips through the at least one inter-bar gap.
A method comprising:
- providing an article of manufacture that comprises:
- an organic laminate substrate;
- first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips;
- and
- a stiffener embedded in the bottom side of the substrate, wherein the stiffener extends across a region that underlies the chip gap region and does not protrude beyond a bottom side metallization of the substrate,
- wherein the stiffener comprises a plurality of stiffener bars that are separated by inter-bar gaps, electrical connections between the chips are made through the inter-bar gaps, the stiffener includes at least one tooth that makes an electrical connection through the substrate to at least one of the chips, and the stiffener comprises a decoupling capacitor that is formed by laminating layers of ceramic and layers of adhesive within the region that underlies the chip gap region;
- and
- subjecting the article of manufacture to thermal mechanical strain, wherein the stiffener mitigates the thermal mechanical strain and warpage of the substrate.
Dependencies are inferred from the claim text.