Controlled induced warping of electronic substrates

An integrated circuit (IC) package, comprising:

• at least one semiconducting die;
• an electronic substrate having an active side and an inactive side opposite the active side, at least one of the at least one semiconducting die and functional circuitry fabricated on the active side,
• at least one of the at least one semiconducting die and the electronic substrate associated with an inherent warping toward the active side,
• and
• the inactive side having at least one corrective layer deposited thereupon via thin film deposition (TFD), the at least one corrective layer configured for desired induced warping of the electronic substrate toward the inactive side,
• wherein the desired induced warping includes a temporary induced warping;
• and
• a portion of the at least one corrective layer opposite at least one functional portion of the at least one semiconducting die is at least partially removable in order to partially restore the inherent warping.