Semiconductor package structures and methods of manufacturing the same

A semiconductor package structure, comprising:

• a substrate structure, having a first surface and a second surface opposite to the first surface;
• at least two electronic components, electrically connected to the first surface of the substrate structure;
• at least one shielding pad, disposed on the first surface of the substrate structure;
• a plurality of vias connected to the at least one shielding pad;
• and
• a plurality of shielding wirebonds disposed between the electronic components, wherein each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and being free from overlapping with any of the plurality of vias,
• wherein the at least one shielding pad is a long pad, and a length of the at least one shielding pad may be greater than a length of the electronic devices.