Semiconductor packages including die over-shift indicating patterns

A semiconductor package comprising:

• a package substrate including a die attachment region;
• a first semiconductor die attached to the die attachment region;
• a second semiconductor die stacked on the first semiconductor die and offset from the first semiconductor die;
• and
• a die over-shift indicating pattern disposed in the package substrate and spaced apart from the die attachment region,
• wherein the die over-shift indicating pattern is used as a reference pattern for obtaining a shifted distance of the second semiconductor die,
• wherein the die over-shift indicating pattern is configured to detect whether the shifted distance of the second semiconductor die is greater than an allowable range, and
• wherein the die over-shift indicating pattern is disposed such that at least a portion of the die over-shift indicating pattern is covered by the second semiconductor die when the shifted distance is greater than the allowable range.