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US 11,239,176 B2Granted
Package comprising identifier on and/or in carrier
AssigneeInfineon Technologies AG
InventorsJochen Dangelmaier, Klaus Elian
Life of this patent
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Abstract
A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
Claims21
A package, comprising:
- a carrier;
- an electronic component mounted on the carrier;
- an identifier indicative of an origin of the package and being formed on and/or in the carrier;
- and
- an encapsulant encapsulating the identifier,
- wherein the identifier comprises a plated layer, and
- wherein the plated layer is on an entire upper main surface of the carrier.
4 more elements
A method of manufacturing a package, wherein the method comprises:
- mounting an electronic component on a carrier;
- forming an identifier indicative of an origin of the package on and/or in the carrier, wherein the identifier comprises a plated layer;
- forming the plated layer by plating an entire upper main surface of the carrier;
- and
- encapsulating the identifier with an encapsulant.
2 more elements
A package, comprising:
- a leadframe comprising a die pad and a plurality of leads;
- an electronic component mounted on the die pad;
- and
- an identifier indicative of an origin of the package formed on and/or in at least one of the plurality of leads,
- wherein the identifier comprises a plated layer, and
- wherein the plated layer is on an entire upper main surface of the leadframe.
3 more elements
Dependencies are inferred from the claim text.