Semiconductor package structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long Lu
Life of this patent
Estimating the term…
Abstract
A semiconductor package structure includes a first semiconductor die, a second semiconductor die, a third semiconductor die and an external contact. The second semiconductor die is disposed adjacent to the first semiconductor die. The third semiconductor die electrically connects the first semiconductor die and the second semiconductor die. The external contact is electrically connected to the third semiconductor die. An electrical path between the third semiconductor die and the external contact extends through a space between the first semiconductor die and the second semiconductor die.
Claims15
A semiconductor package structure, comprising:
- a first semiconductor die;
- a second semiconductor die disposed adjacent to the first semiconductor die;
- a third semiconductor die electrically connecting the first semiconductor die and the second semiconductor die;
- a plurality of first pillars disposed adjacent to the first semiconductor die and/or the second semiconductor die;
- a plurality of second pillars disposed adjacent to the third semiconductor die, wherein a pillar space between the plurality of first pillars is less than a pillar space between the plurality of second pillars;
- and
- an external contact electrically connected to the third semiconductor die, wherein an electrical path between the third semiconductor die and the external contact extends through a space between the first semiconductor die and the second semiconductor die.
A semiconductor package structure, comprising:
- a first semiconductor die;
- a second semiconductor die disposed adjacent to the first semiconductor die;
- a third semiconductor die electrically connecting the first semiconductor die and the second semiconductor die;
- a first encapsulant covering the first semiconductor die and/or the second semiconductor die, wherein a portion of the first encapsulant is disposed between the first semiconductor die and the second semiconductor die;
- a second encapsulant covering the third semiconductor die, and a width of the second encapsulant is greater than a width of the third semiconductor die;
- a third encapsulant disposed between and covering the first encapsulant and the second encapsulant;
- and
- an external contact electrically connected to the third semiconductor die, wherein the first semiconductor die and the second semiconductor die are disposed between the third semiconductor die and the external contact.
Dependencies are inferred from the claim text.