Stacked modules

A module comprising:

• a lower component of the module having a first material in which at least a first structural element is embedded, and
• an upper component of the module having a second material in which at least a second structural element is embedded,
• a metallization arranged on an exterior surface of the module which allows an electromagnetic shielding of the module or which is used to dissipate heat from the module,
• wherein the upper component of the module and the lower component of the module are stacked on top of one another,
• wherein the lower and the upper components of the module are in electrical connection and are mechanically connected, and
• wherein at least one of the components of the module, on a side facing the other component of the module, has a rewiring layer having a metal coating, by means of which the module components are electrically connected together.

A module comprising:

• a lower component of the module having a first material in which at least a first structural element is embedded, and
• an upper component of the module having a second material in which at least a second structural element is embedded, the upper component being electrically and mechanically connected to the lower component,
• wherein the upper component has a rewiring layer having a metal coating that forms an antenna structure connected with the second structural element,
• wherein the upper component and the lower component are stacked on top of one another, and
• wherein an acoustic wave filter is the first structural element and/or the second structural element.

A module comprising:

• a lower component having a first structural element embedded in a first material,
• an upper component, mechanically connected to and stacked on the lower component, having second structural element embedded in a second material,
• wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter,
• wherein at least one of the lower and upper components of the module has, on a side facing the other of the lower and upper component of the module, a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together, and a second rewiring layer on an opposite upper side, and
• wherein the first and second rewiring layers are connected with a plated through hole that extends through the component of the module.

A module comprising:

• a lower component having a first structural element embedded in a first material,
• an upper component, mechanically connected to and stacked on the lower component, having second structural element embedded in a second material,
• wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter,
• wherein at least one of the lower and upper components of the module, on a side facing the other of the lower and upper component of the module, has a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together;
• and
• wherein the lower component of the module has metal columns on an upper side facing the upper component of the module,
• wherein the upper component of the module has metal columns on an under side facing the lower component of the module, and
• wherein the metal columns of the lower component of the module and the metal columns of the upper component of the module are connected.