E-fuse with dielectric zipping
AssigneeInternational Business Machines Corporation
InventorsTianji Zhou, Saumya Sharma, Ashim Dutta, Chih-Chao Yang
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AssigneeInternational Business Machines Corporation
InventorsTianji Zhou, Saumya Sharma, Ashim Dutta, Chih-Chao Yang
Estimating the term…
E-fuses and techniques for fabrication thereof using dielectric zipping are provided. An e-fuse device includes: a first dielectric layer disposed on a substrate; at least one first electrode of the e-fuse device present in the first dielectric layer; a second dielectric layer disposed on the first dielectric layer; vias present in the second dielectric layer, wherein at least one of the vias is present over the at least one first electrode and has a critical dimension CDA″, wherein the vias adjacent to the at least one via having the critical dimension CDA″ each have a critical dimension of CDB″, and wherein CDB″>CDA″; a liner disposed in each of the vias; and a metal that serves as a second electrode of the e-fuse device disposed in each of the vias over the liner. A method of operating an e-fuse device is also provided.
An electronic-fuse (e-fuse) device, comprising:
A method of forming an e-fuse device, the method comprising the steps of:
A method of operating an e-fuse device, the method comprising the steps of:
Dependencies are inferred from the claim text.