Wire bond inductor structures for flip chip dies

An integrated circuit (IC) package, comprising:

• a die, including an active layer opposite a backside surface of the die, the active layer coupled to the backside surface of the die by through silicon vias (TSVs);
• a package substrate coupled to the active layer, the package substrate comprising a plurality of package pads corresponding to the plurality of backside pads;
• and
• a passive device comprising a plurality of wire bonds coupled to the package pads through the TSVs.

A method of forming an inductor, comprising:

• forming a plurality of backside pads on a back side of a die;
• forming package bumps on a front side of the die;
• assembling the die on a package substrate comprising a plurality of package pads corresponding to the plurality of backside pads;
• and
• forming a passive device comprising coupling a wire bond between the plurality of backside pads and the plurality of package pads.

An integrated circuit (IC) apparatus, comprising:

• means for forming a plurality of backside pads on a back side of a die;
• means for forming package bumps on a front side of the die;
• means for assembling the die on a package substrate comprising a plurality of package pads corresponding to the plurality of backside pads;
• and
• means for forming a passive device comprising coupling a wire bond between the plurality of backside pads and the plurality of package pads.