Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungkwan Lee, Youngsik Hur, Taehee Han
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a core layer formed of a ferromagnetic material, and includes a frame passing through the core layer and having a through-hole, a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed, and an inactive surface opposite to the active surface, an encapsulant covering at least a portion of the semiconductor chip, and a first connection structure including a first redistribution layer disposed on the active surface of the semiconductor chip and electrically connected to the connection pad.
Claims16
A semiconductor package, comprising:
- a frame including:
- a core layer formed of a ferromagnetic material;
- a through-hole passing through the core layer;
- a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface
- a first wiring layer disposed on an upper surface of the core layer and a second wiring layer disposed on a lowermost surface of the core layer, a lower surface of the second wiring layer being lower than the lowermost surface of the core layer;
- and
- a connection via passing through the core layer and disposed between the first wiring layer and the second wiring layer;
- and
- a core insulating layer covering at least a portion of a surface of the core layer, the core insulating layer being provided directly between the lowermost surface of the core layer and an upper surface of the second wiring layer;
- an encapsulant covering at least a portion of the semiconductor chip;
- and
- a first connection structure disposed on the active surface of the semiconductor chip, and including a first redistribution layer electrically connected to the connection pad.
A semiconductor package, comprising:
- a frame including a core layer formed of a ferromagnetic material, and a through-hole passing through the core layer;
- a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface;
- an encapsulant covering at least a portion of the semiconductor chip;
- and a first connection structure disposed on the active surface of the semiconductor chip, and including a first redistribution layer electrically connected to the connection pad,
- wherein the frame further includes a first wiring layer and a second wiring layer disposed on both sides of the core layer, respectively, first and second build-up layers disposed on both sides of the core layer, respectively, and covering at least portions the first and second wiring layers, respectively, a third wiring layer disposed on the first build-up layer, and a fourth wiring layer disposed on the second build-up layer, and
- the first to fourth wiring layers are electrically connected to the connection pad.
A semiconductor package, comprising:
- a frame having a through-hole and a core layer formed of a ferromagnetic material wherein the core layer surrounds the through-hole;
- a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface;
- an encapsulant covering at least a portion of the semiconductor chip;
- and
- a connection structure disposed on the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad,
- wherein the frame has magnetic properties due to the core layer,
- wherein the frame further includes a core insulating layer covering at least a portion of a surface of the core layer,
- wherein the core insulating layer includes prepreg or an Ajinomoto Build-up Film (ABF).
Dependencies are inferred from the claim text.