Package structure
AssigneeIndustrial Technology Research Institute
InventorsChien-Min Hsu, Chih-Ming Shen
Life of this patent
Estimating the term…
Abstract
A package structure is provided. The package structure includes a substrate. The package structure also includes a hybrid pad disposed on the substrate. The hybrid pad includes a metal layer and a buffer layer connected to the metal layer. The Young's modulus of the buffer layer is less than the Young's modulus of the metal layer. The package structure further includes an electrically connecting structure disposed on the hybrid pad. The package structure includes a chip layer electrically connected to the electrically connecting structure. The package structure also includes a bonding pad disposed between the electrically connecting structure and the chip layer.
Claims12
A package structure, comprising:
- a substrate;
- a hybrid pad disposed on the substrate, wherein the hybrid pad comprises a metal layer and a buffer layer connected to the metal layer, and a Young's modulus of the buffer layer is less than a Young's modulus of the metal layer;
- an electrically connecting structure disposed on the hybrid pad;
- a chip layer electrically connected to the electrically connecting structure;
- and
- a bonding pad disposed between the electrically connecting structure and the chip layer,
- wherein the metal layer and the buffer layer are in direct contact with the substrate.
Dependencies are inferred from the claim text.