Electronic component module
AssigneeKabushiki Kaisha Toshiba
InventorsYoichiro Kurita, Hideto Furuyama
Life of this patent
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Abstract
According to one embodiment, the electrode pads are provided at a surface of the substrate. The metal pad is provided at the surface of the substrate. The electronic component is mounted to the surface of the substrate. The electronic component includes a plurality of opposing electrodes. The opposing electrodes oppose the electrode pads in a direction toward the surface direction and are electrically connected to the electrode pads. The positioning component is fixed to the metal pad. A gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate is shorter than a minimum distance of the electrode pads.
Claims20
An electronic component module, comprising:
- a substrate;
- a plurality of electrode pads provided at a surface of the substrate;
- at least one metal pad provided at the surface of the substrate;
- an electronic component mounted to the surface of the substrate, the electronic component including a plurality of opposing electrodes, the plurality of opposing electrodes opposing the plurality of electrode pads in a direction toward the surface direction and being electrically connected to the plurality of electrode pads;
- and
- at least one positioning component fixed to the metal pad with a bonding material different from a material of the positioning component,
- a gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate being shorter than a minimum distance of the plurality of electrode pads.
An electronic component module, comprising:
- a substrate;
- a plurality of electrode pads provided at a surface of the substrate;
- at least three metal pads provided at the surface of the substrate, an arrangement relationship of the at least three metal pads at the surface of the substrate causing lines connecting the at least three metal pads to each other to include a triangle;
- an electronic component mounted to the surface of the substrate, the electronic component including a plurality of opposing electrodes, the plurality of opposing electrodes opposing the plurality of electrode pads in a direction toward the surface direction and being electrically connected to the plurality of electrode pads;
- and
- at least three positioning components fixed to the metal pads with a bonding material different from a material of the positioning component,
- a gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate being shorter than a minimum distance of the plurality of electrode pads.
Dependencies are inferred from the claim text.