Semiconductor device and method of producing semiconductor device

A semiconductor device, comprising:

• a mounting substrate;
• a first wiring electrode, a second wiring electrode, and an interposing member disposed between the first wiring electrode and the second wiring electrode, the first wiring electrode, the second wiring electrode, and the interposing member being disposed on a main surface of the mounting substrate;
• a semiconductor element which is flip-chip connected with the first wiring electrode and the second wiring electrode via a first electrical connection member and a second electrical connection member, and at least partially overlaps the interposing member in a top surface view;
• and
• a resin disposed in contact with the semiconductor element and the mounting substrate,
• wherein wettability of the interposing member to the resin is higher than wettability of the mounting substrate to the resin, and
• the resin is disposed in contact with the semiconductor element and the interposing member.