Lead frame package

A lead frame package, comprising:

• a first conductive layer having a plurality of conductive carriers;
• a first electronic component having a plurality of first pins;
• a plurality of lead frames, wherein the plurality of lead frames and the plurality of first pins of the first electronic component are respectively electrically connected to the plurality of conductive carriers of the first conductive layer;
• a second conductive layer having a plurality of conductive joints respectively electrically connected to the plurality of lead frames so as to be electrically connected to at least a part of the plurality of conductive carriers of the first conductive layer via the plurality of lead frames;
• and
• a package body, encapsulating the first conductive layer, the first electronic component, and the plurality of lead frames;
• wherein the first conductive layer and the second conductive layer are located on two opposite sides of the first electronic component, respectively.