Power device embedded driver board assemblies with cooling structures and methods thereof

A driver board assembly, comprising:

• a first substrate having a first surface and an opposite second surface, at least one jet impingement assembly formed on the first surface of the first substrate, wherein the at least one jet impingement assembly extends in a system vertical direction from the first surface, the at least one jet impingement assembly includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface;
• a second substrate having a first substrate surface and a second substrate surface opposite the first substrate surface, wherein the first substrate surface is bonded onto a second surface of the first substrate, and the second substrate surface has a recess;
• a plurality of receiving contours etched within the first surface of the first substrate;
• one or more power device assemblies bonded into the recess of the second substrate surface of the second substrate;
• and
• a cooling manifold having a first cooling surface and an opposite second cooling surface and a cavity that extends within the first cooling surface, wherein the first cooling surface is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate, and the cavity of the first cooling surface receives at least a portion of the first substrate and the at least one jet impingement assembly.