Adhesive and thermal interface material on a plurality of dies covered by a lid
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan
Life of this patent
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Abstract
Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the second die are disposed side by side on the interposer. The underfill layer is disposed between the first die and the second die. The TIM is disposed on the first die, the second die, and the underfill layer. The adhesive pattern is disposed between the underfill layer and the TIM to separate the underfill layer from the TIM.
Claims20
A package structure, comprising:
- a first die and a second die group, disposed side by side on an interposer;
- an underfill layer, disposed between the first die and the second die group;
- a thermal interface material (TIM), disposed on the first die, the second die group, and the underfill layer;
- an adhesive pattern, disposed between the underfill layer and the TIM to separate the underfill layer from the TIM;
- and
- an encapsulant laterally encapsulating the first die, the second die group, and the underfill layer, wherein a sidewall of the encapsulant is substantially aligned with a sidewall of the interposer.
A package structure, comprising:
- a first die and a second die, disposed side by side on an interposer;
- an underfill layer, disposed between the first die and the second die;
- a thermal interface material (TIM), disposed on the first die, the second die, and the underfill layer, wherein the TIM has an edge thickness greater than a center thickness of the TIM;
- and
- a lid, adhered to the TIM, wherein the TIM has a first concave top surface, the lid conformally covers the first concave top surface of the TIM, and the lid has a second concave top surface corresponding to the first concave top surface.
A method of forming a package structure, comprising:
- bonding a first die and a second die onto an interposer;
- dispensing an underfill layer between the first die and the second die;
- forming a first encapsulant to laterally encapsulate the first die, the second die, and the underfill layer;
- forming an adhesive pattern on the underfill layer between the first die and the second die and on the first encapsulant;
- and
- dispensing a thermal interface material (TIM) on the adhesive pattern, wherein a sidewall of the first encapsulant is substantially aligned with a sidewall of the interposer.
Dependencies are inferred from the claim text.