Package structure and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
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Abstract
A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.
Claims20
A method, comprising:
- placing devices in cavities of a tray, wherein the devices has a backside surface and planar side surfaces, and a depth of the cavities is greater than a height of the devices;
- forming a metallic material layer covering the devices and the tray, wherein the metallic material layer has a first portion covering the backside surface of the device and second portions covering the planar side surfaces of the device, and the first portion and the second portion has the same thickness;
- pick-up at least one of the devices covered by the metallic material layer from the tray such that a metal layer of the metallic material layer is separated from a residue portion of the metallic material layer, wherein the metal layer at least covers a back surface of the at least one of devices, and the residue portion covers the tray;
- mounting at least one of the devices covered by the metal layer onto a circuit substrate;
- and
- mounting a lid on the circuit substrate, wherein the lid is adhered to the metal layer on the at least one of the devices through a thermal interface material layer.
A method, comprising:
- providing a tray having a plurality of cavities;
- placing a plurality of devices in each of the plurality of cavities of the tray, wherein the plurality of devices comprises an active surface having conductive terminals located thereon, and a backside surface opposite to the active surface, and the plurality of devices is placed into each of the plurality of cavities in a faced down manner so that the conductive terminals are facing towards a base portion of the tray;
- providing a shielding mask over the plurality of devices and over the tray, wherein the shielding mask include apertures exposing the backside surface of the plurality of devices;
- forming a metal layer on the backside surface of the plurality of devices through the apertures of the shielding mask;
- removing the shielding mask;
- and
- removing the plurality of devices from the tray.
A method, comprising:
- providing a semiconductor device, the semiconductor device comprises:
- at least one semiconductor die;
- an insulating encapsulation surrounding the at least one semiconductor die, wherein a backside surface of the at least one semiconductor die is revealed by the insulating encapsulation;
- and
- conductive terminals electrically connected to the at least one semiconductor die;
- placing the semiconductor device onto a tray to support the semiconductor device;
- providing a shielding mask over the semiconductor device and over the tray, wherein the shielding mask include apertures exposing the backside surface of the at least one semiconductor die;
- forming a metal layer covering the backside surface of the at least one semiconductor die through the apertures of the shielding mask;
- removing the shielding mask and the semiconductor device from the tray;
- and
- placing the semiconductor device on a circuit substrate.
Dependencies are inferred from the claim text.