Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorTomoyuki Wakiyama
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Abstract
A semiconductor module, including a laminated substrate that has an insulating plate, a circuit board disposed on a top surface of the insulating plate, and a heat dissipation plate disposed on a bottom surface of the insulating plate. The semiconductor module further has a semiconductor element disposed on a top surface of the circuit board, a metal wiring board disposed on a top surface of the semiconductor element, and a temperature sensor that detects a temperature of the semiconductor element, and that is disposed on a top surface of the metal wiring board. The metal wiring board includes a heat blocking part that blocks heat of the semiconductor element.
Claims8
A semiconductor module, comprising:
- a laminated substrate including
- an insulating plate,
- a circuit board disposed on a top surface of the insulating plate, and
- a heat dissipation plate disposed on a bottom surface of the insulating plate;
- a semiconductor element disposed on a top surface of the circuit board;
- a metal wiring board disposed on a top surface of the semiconductor element;
- and
- a temperature sensor that detects a temperature of the semiconductor element, the temperature sensor being disposed on a top surface of the metal wiring board, wherein
- the metal wiring board includes a heat blocking part that blocks heat of the semiconductor element.
Dependencies are inferred from the claim text.