Selective molding for integrated circuit
AssigneeTexas Instruments Incorporated
InventorsDolores Babaran Milo, Floro Lopez Camenforte, III, Joe Anne Feive Carbonell Lopez
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Abstract
A method includes performing a first molding process to enclose a portion of a first semiconductor die in a first package structure with an opening that exposes a portion of a second semiconductor die mounted to the first semiconductor die, as well as performing a deposition process to deposit a stress absorbing material in the opening of the first package structure to cover the portion of the second semiconductor die, and performing a second molding process to enclose a portion of the stress absorbing structure in a second package structure that extends on a side of the first package structure.
Claims23
A method, comprising:
- performing a first die attach process that attaches a first side of a first semiconductor die to a die attach pad of a lead frame;
- performing a second die attach process that attaches a second semiconductor die to a second side of the first semiconductor die;
- performing a wire bonding process that connects a first bond wire between a first conductive bond pad of the first semiconductor die to a lead of the lead frame, the wire bonding process connecting a second bond wire between a second conductive bond pad of the first semiconductor die and a conductive bond pad of the second semiconductor die;
- performing a first molding process that encloses a portion of the die attach pad, a portion of the first semiconductor die, a portion of the lead, and the first bond wire in a first package structure with an opening that exposes a portion of the second semiconductor die;
- performing a deposition process that deposits a stress absorbing material in the opening of the first package structure to cover the portion of the second semiconductor die;
- and
- performing a second molding process that encloses a portion of the stress absorbing structure in a second package structure that extends on a side of the first package structure.
A method to fabricate a stress absorbing glob top structure in an electronic device, the method comprising:
- performing a first molding process that encloses a portion of a first semiconductor die in a first package structure with an opening that exposes a portion of a second semiconductor die that is mounted to the first semiconductor die;
- performing a deposition process that deposits a stress absorbing material in the opening of the first package structure to cover the portion of the second semiconductor die;
- and
- performing a second molding process that encloses a portion of the stress absorbing structure in a second package structure that extends on a side of the first package structure.
A method, comprising:
- performing a first die attach process that attaches a first side of a first semiconductor die to a die attach pad of a lead frame;
- performing a second die attach process that attaches a second semiconductor die to a second side of the first semiconductor die;
- performing a first molding process that encloses a portion of the die attach pad, a portion of the first semiconductor die in a first package structure with an opening that exposes a portion of the second semiconductor die;
- performing a deposition process that deposits a stress absorbing material in the opening of the first package structure to cover the portion of the second semiconductor die;
- and
- performing a second molding process that encloses a portion of the stress absorbing structure in a second package structure that extends on a side of the first package structure.
Dependencies are inferred from the claim text.