Package cooling by coil cavity
AssigneeMicron Technology, Inc.
InventorsAndrew M. Bayless, Wayne H. Huang, Owen R. Fay
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly can include a first die package comprising a bottom side; a top side; and lateral sides extending between the top and bottom sides. The assembly can include an encapsulant material encapsulating the first die package. In some embodiments, the assembly includes a cooling cavity in the encapsulant material. The cooling cavity can have a first opening; a second opening; and an elongate channel extending from the first opening to the second opening. In some embodiments, the elongate channel surrounds at least two of the lateral sides of the first die package. In some embodiments, the elongate channel is configured to accommodate a cooling fluid.
Claims19
A method of manufacturing a semiconductor device, the method comprising:
- surrounding at least two sides of a die package with a sacrificial member;
- encapsulating the die package and sacrificial member in an encapsulant material;
- and
- removing the sacrificial member after encapsulating the die package and sacrificial member in the encapsulant material;
- wherein at least a portion of the encapsulant material is in contact with at least a portion of the die package after removing the sacrificial member.
A method of manufacturing a semiconductor device, the method comprising:
- surrounding at least two sides of a die package with a sacrificial member, wherein at least a portion of the sacrificial member is spaced from the die package;
- encapsulating the die package and sacrificial member in an encapsulant material;
- and
- removing the sacrificial member via a non-mechanical removal process.
A semiconductor device assembly comprising:
- a die package comprising:
- a bottom side;
- a top side;
- and
- lateral sides extending between the top and bottom sides;
- an encapsulant material encapsulating, molded over, and in contact with at least a portion of the die package;
- and
- a cooling cavity in the encapsulant material, the cooling cavity comprising:
- only one inlet into the encapsulant material;
- only one outlet from the encapsulant material;
- and
- an elongate channel extending without branches or forks from the inlet to the outlet;
- wherein the elongate channel surrounds at least two lateral sides of the first die package.
Dependencies are inferred from the claim text.