Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

A microelectronic device, comprising:

• a first interposer substrate having an upper surface and a lower surface opposite the upper surface, wherein the first interposer substrate includes a first array of at least four pads carried by the lower surface;
• a microelectronic die carried on the upper surface of the first interposer substrate and electrically coupled to the first interposer substrate;
• a standoff disposed over the microelectronic die;
• a second interposer substrate disposed over the standoff and electrically coupled to the first interposer substrate, wherein the second interposer substrate includes a second array of at least four pads carried by an upper surface of the second interposer substrate;
• and
• a casing at least partially encapsulating the microelectronic die, the standoff, and the second interposer substrate,
• wherein each individual pad in the first array of pads has a centerline that is vertically aligned with a centerline of a corresponding individual pad in the second array of pads.

A stacked microelectronic device, comprising:

• a first microelectronic device, including:
• a first lower substrate,
• a first microelectronic die carried on the first lower substrate and electrically coupled to the first lower substrate,
• a first standoff disposed over the first microelectronic die,
• a first upper substrate disposed over the first standoff and electrically coupled to the first lower substrate, and
• a casing at least partially encapsulating the first microelectronic die, the first standoff, and the first upper substrate;
• and
• a second microelectronic device, including:
• a second lower substrate,
• a second microelectronic die carried on the second lower substrate and electrically coupled to the second lower substrate,
• a second standoff disposed over the second microelectronic die,
• a second upper substrate disposed over the second standoff and electrically coupled to the second lower substrate, and
• a second casing at least partially encapsulating the second microelectronic die, the second standoff, and the second upper substrate,
• wherein the second lower substrate is disposed over the first upper substrate and electrically coupled to the first upper substrate by a plurality of electrical couplers.