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US 11,239,126 B2Granted
Rod-based substrate with ringed interconnect layers
AssigneeIntel Corporation
InventorsFlorence Su Sin Phun, Wei Jern Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin, Kai Chong Ng
Life of this patent
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Abstract
An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.
Claims26
An apparatus comprising:
- a rod-shaped substrate including a rod long axis;
- a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis;
- and
- a second layer, including a second interconnect, substantially surrounding the first layer in the first plane;
- wherein (a) the substrate includes a first metal transmission line including a first long axis substantially parallel to the rod long axis, and (b) the first layer substantially surrounds the first metal transmission line in the first plane.
2 more elements
A method comprising:
- provide a rod-shaped substrate including a rod long axis;
- form a first copper layer over the rod-shaped substrate;
- apply a first photoresist layer to the first copper layer and pattern the first copper layer, based on the first photoresist layer, to form copper interconnects;
- apply a dielectric layer over the copper interconnects and form first and second vias within the dielectric layer and in contact with the copper interconnects;
- form a second copper layer over the dielectric layer and within the first and second vias;
- apply a second photoresist layer to the second copper layer and pattern the second photoresist layer to expose the first and second vias and the second copper layer;
- and
- form a third copper layer within the first and second vias.
5 more elements
An apparatus comprising:
- a rod-shaped substrate including a rod long axis;
- a first layer, which includes a first via and first insulating material, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis;
- and
- a second layer, which includes a second via and second insulating material, substantially surrounding the first layer in the first plane.
1 more element
Dependencies are inferred from the claim text.