Carrier structure and package structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsHsien-Lung Hsiao, Yu-Cheng Pai, Chia-Chi Lo, Szu-Hsien Chen, Shu-Chi Chang
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Abstract
A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.
Claims14
A carrier structure defined with a retained region and a removal region adjoining each other, the carrier structure comprising:
- a plurality of substrates provided in the retained region;
- a separation portion provided between the substrates in the retained region;
- and
- a periphery portion provided in the removal region and formed with at least one opening,
- wherein the periphery portion includes a plurality of electroplated conductive wires electrically connected with the substrates and exposed from a side surface of the carrier structure, and
- wherein at least two of the electroplated conductive wires are meshed boxes and connected to each other via at least one extension lead.
A package structure, comprising:
- a carrier structure defined with a retained region and a removal region adjoining each other, wherein the carrier structure includes:
- a plurality of substrates provided in the retained region;
- a separation portion provided between the substrates in the retained region;
- and
- a periphery portion provided in the removal region and formed with at least one opening, wherein the periphery portion includes a plurality of electroplated conductive wires electrically connected with the substrates and exposed from a side surface of the carrier structure, and wherein at least two of the electroplated conductive wires are meshed boxes and connected to each other via at least one extension lead;
- a plurality of electronic components disposed on and electrically connected to the substrates;
- and
- an encapsulating layer formed on the retained region and encapsulating the plurality of electronic components.
Dependencies are inferred from the claim text.