Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body
AssigneeMitsubishi Electric Corporation
InventorYukimasa Hayashida
Life of this patent
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Abstract
An object is to provide a technique capable of fixing a cover to a container body without using a dedicated fixation mechanism and fixation member. A semiconductor device includes: a container body having a space with an opening; a semiconductor element disposed in the space in the container body; a sealing member disposed in the space in the container body to cover the semiconductor element; and a cover covering the opening of the container body, wherein a convex portion protruding into the space is provided on the cover, and the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured.
Claims12
A semiconductor device, comprising:
- a container body having a space with an opening;
- a semiconductor element disposed in the space in the container body;
- a sealing member disposed in the space in the container body to cover the semiconductor element;
- and
- a cover covering the opening of the container body, wherein
- at least one convex portion protruding into the space from a surface of the cover, and
- the cover is fixed to the container body only by embedding at least a tip portion of the at least one convex portion in the sealing member which has been cured, so that the sealing member does not directly contact the surface of the cover.
A semiconductor device, comprising:
- a container body having a space with an opening;
- a semiconductor element disposed in the space in the container body;
- an electrode connecting the semiconductor element to an exterior of the container body;
- a sealing member disposed in the space in the container body to cover the semiconductor element;
- and
- a cover covering the opening of the container body, wherein
- at least one convex portion protruding into the space is provided on the cover, and
- the cover is fixed to the container body only by embedding at least a tip portion of the at least one convex portion in the sealing member which has been cured.
A semiconductor device, comprising:
- a container body having a space with an opening;
- a semiconductor element disposed in the space in the container body;
- a sealing member disposed in the space in the container body to cover the semiconductor element;
- and
- a cover covering the opening of the container body, wherein
- at least one convex portion protruding into the space is provided on the cover, the at least one convex portion being formed of a same material as the cover, and
- the cover is fixed to the container body only by embedding at least a tip portion of the at least one convex portion in the sealing member which has been cured.
Dependencies are inferred from the claim text.