Semiconductor module, semiconductor device, and vehicle

A semiconductor module comprising:

• a base plate including a fixed surface and a radiating surface which is a surface opposite to the fixed surface;
• an insulating substrate bonded to the fixed surface of the base plate;
• first and second conductive patterns on the insulating substrate;
• a semiconductor chip on the first conductive pattern;
• a wiring member connecting the semiconductor chip to the second conductive pattern;
• resin sealing the fixed surface of the base plate, the insulating substrate, the first and second conductive patterns, the semiconductor chip, and the wiring member;
• and
• a case surrounding the insulating substrate, the first and second conductive patterns, the semiconductor chip and the wiring member and bonded to the fixed surface of the base plate,
• wherein the base plate includes a single metal part, and a reinforcing member provided in the metal part and having a Young's modulus which is higher than a Young's modulus of the metal part,
• the base plate includes at least one protrusion structure integrally formed with the metal part and protruding outward from the radiating surface, the metal part having a constant thickness at every position except positions where the at least one protrusion structure protrudes outward from the radiating surface,
• a thickness of the reinforcing member is smaller than the thickness of the metal part,
• the entire reinforcing member is located on the protrusion structure side with respect to the center of the base plate in cross section of the base plate,
• the resin includes first resin sealing peripheries of the semiconductor chip and the wiring member and second resin sealing the outside of the first resin,
• the first resin has a Young's modulus which is lower than a Young's modulus of the second resin,
• the first resin is thicker than the second resin, when viewed in cross-section, and
• the first resin is potted using the case as a mold.