Wafer supply device

A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device comprising:

• a die information storage section configured to store a number of the dies for each rank allocated to each of the dies;
• a block information acquisition section configured to acquire a condition of the dies to be mounted on a block provided on a board to be conveyed;
• a required block number acquisition section configured to acquire a required number of the dies to be mounted on the block;
• and
• a producible number calculation section configured to calculate a number of producible blocks based on a content stored in the die information storage section and a content which is acquired by the block information acquisition section and the required block number acquisition section;
• a spare setting section configured to set a part of the dies stored in the wafer supply device as spare dies to be used for recovery, for each rank;
• and
• a control section configured to populate the board based on the calculated number of producible blocks,
• wherein the producible number calculation section calculates a producible number of the blocks in a state where the number of the spare dies set for each rank by the spare setting section is subtracted from a total number of the dies, for each rank stored in the wafer supply device.